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<blockquote data-quote="wingless" data-source="post: 8527043" data-attributes="member: 670965"><p>That is mostly correct, but the details are important.</p><p>Without getting into forced air, or mechanical refrigeration, the best case is free air, open and unrestricted in all directions, except for the mounting surface, away from all other heat sources.</p><p></p><p>In practice, the minimum workable clearance is usually 1" from another surface.</p><p></p><p>When it comes to placing equipment within a "sealed" or still air region, frequently the most important factors are the volume of that region and the aspect ratio. For example, a tall narrow volume will permit air convection currents to be established for better heat removal, especially as-compared to a short wide compartment.</p><p></p><p>Also, placing the device at the bottom of the volume will permit it to run cooler than placing it at the top.</p><p></p><p>For electronics, they want to run cool for maximum life. The MTBF is reduced by half for every 10C increase in temperature. A good ballpark is that electronics are typically designed for at least a 10 year MTBF, so making them run 10C hotter because of limited airflow will decrease that to a 5 year MTBF.</p><p></p><p>If this were me I would run two tests where the temperature is measured at a hot location on the device using a thermocouple. One test would be in free air, the other would be in the possible mounting volume. Then examine those two temperatures to see if the results are acceptable.</p></blockquote><p></p>
[QUOTE="wingless, post: 8527043, member: 670965"] That is mostly correct, but the details are important. Without getting into forced air, or mechanical refrigeration, the best case is free air, open and unrestricted in all directions, except for the mounting surface, away from all other heat sources. In practice, the minimum workable clearance is usually 1" from another surface. When it comes to placing equipment within a "sealed" or still air region, frequently the most important factors are the volume of that region and the aspect ratio. For example, a tall narrow volume will permit air convection currents to be established for better heat removal, especially as-compared to a short wide compartment. Also, placing the device at the bottom of the volume will permit it to run cooler than placing it at the top. For electronics, they want to run cool for maximum life. The MTBF is reduced by half for every 10C increase in temperature. A good ballpark is that electronics are typically designed for at least a 10 year MTBF, so making them run 10C hotter because of limited airflow will decrease that to a 5 year MTBF. If this were me I would run two tests where the temperature is measured at a hot location on the device using a thermocouple. One test would be in free air, the other would be in the possible mounting volume. Then examine those two temperatures to see if the results are acceptable. [/QUOTE]
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